发明名称 Polymerizable compound, polymerizable composition and cured product containing the compound
摘要 A polymerizable compound represented by formula (1): wherein each R<SUP>1 </SUP>independently represents at least one organic residue selected from the group consisting of alkylene groups, branched alkylene groups, cycloalkylene groups and arylene groups, R<SUP>2 </SUP>represents an organic residue derived from an alcohol compound, a phenol compound or a carboxylic acid compound, n represents an integer of 0 to 20, a production process of the polymerizable composition, a composition using the polymerizable compound, a cured product obtained by curing the composition and a production process of the cured product. The polymerizable compound exhibits a good adhesive property to a substrate such as glass and is imparted with radical polymerizability to enable heat curing and/or active energy ray curing.
申请公布号 US7049350(B2) 申请公布日期 2006.05.23
申请号 US20040484877 申请日期 2004.01.27
申请人 SHOWA DENKO K.K. 发明人 HONDA YOSHIHIRO;OHTA KEISUKE;OOGA KAZUHIKO;KAI KAZUFUMI;UCHIDA HIROSHI
分类号 C08F2/46;C07C67/26;C07C69/60;C08F2/00;C08F216/12 主分类号 C08F2/46
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