发明名称 POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMATION
摘要 <p>A means for increasing development velocity of a positive photoresist composition is provided which contains a photosensitive novolak resin formed by replacing some hydrogen atoms within those of all phenolic hydroxyl groups of alkali soluble novolak resin by 1,2- naphthoquinonediazide sulfonyl group. This means is positive photoresist composition and a formation method of a resist pattern using the composition which contains (A) a photosensitive novolak resin formed by replacing some hydrogen atoms within those of all phenolic hydroxyl groups of alkali soluble novolak resin by 1,2-naphthoquinonediazide sulfonyl group, which is dissolved in (B) propylene glycol alkyl ether acetate.</p>
申请公布号 KR20060055546(A) 申请公布日期 2006.05.23
申请号 KR20067004821 申请日期 2006.03.09
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 MASUDA YASUO;OKUI TOSHIKI
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
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