发明名称 |
Apparatus for transferring wafer and ring |
摘要 |
For wafer processing, wafers are transferred between a thermal treatment chamber and a thermal treatment installation. The treatment chamber has a top section and a bottom section between which the wafer is accommodated during treatment. The thermal treatment installation has a loading chamber having loading means and transport means. The wafer is place on a wafer support while in the loading chamber, wherein the wafer support is configured as a ring having support elements to support the wafer. The wafer support loaded with the wafer is inserted into the thermal treatment chamber so that the wafer and the wafer support are positioned between the top section and the bottom section. The wafer is individually processed in the thermal treatment chamber. After processing the wafer, the wafer support is removed from the thermal treatment chamber.
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申请公布号 |
US7048488(B1) |
申请公布日期 |
2006.05.23 |
申请号 |
US20010009851 |
申请日期 |
2001.11.06 |
申请人 |
ASM INTERNATIONAL N.V. |
发明人 |
KUZNETSOV VLADIMIR IVANOVICH;OOSTERLAKEN THEODORUS GERARDUS MARIA;RIDDER CHRISTIANUS GERARDUS MARIA;GRANNEMAN ERNST HENDRIK AUGUST |
分类号 |
B65G25/00;H01L21/00;H01L21/677 |
主分类号 |
B65G25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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