发明名称 Method of forming multi-piled bump
摘要 In the method of forming a multi-piled bump, metal balls can be stably and securely piled so as to form the multi-piled bump having a prescribed height. The method of the present invention comprises the steps of: holding a metal wire by a capillary; sparking and melting the wire so as to form metal balls; piling a plurality of the metal balls with applying a load and ultrasonic vibrations thereto, and characterized in that a tail length of the metal wire, which is held by the capillary, is controlled to make a gap between a center of the metal wire and a center of the metal ball one half of a diameter of the metal wire or less.
申请公布号 US7049217(B2) 申请公布日期 2006.05.23
申请号 US20040817807 申请日期 2004.04.06
申请人 FUJITSU LIMITED 发明人 ISHIKAWA NAOKI;TAKEUCHI SHUICHI;KIRA HIDEHIKO
分类号 H01L21/44;H01L21/00;H01L21/60;H01L21/607;H01L25/065 主分类号 H01L21/44
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