发明名称 |
Method of defining features on materials with a femtosecond laser |
摘要 |
The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.
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申请公布号 |
US7049543(B2) |
申请公布日期 |
2006.05.23 |
申请号 |
US20030704459 |
申请日期 |
2003.11.07 |
申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
ROOS EDWARD VICTOR;ROESKE FRANKLIN;LEE RONALD S.;BENTEROU JERRY J. |
分类号 |
B23K26/38;B23K26/06;B23K26/40 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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