Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly

摘要

The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.