发明名称 Low thermal expansion materials
摘要 It is a principal object of the present invention to provide low thermal expansion materials able to answer to the needs of various uses. The present invention relates to low thermal expansion materials constituted substantially from a crystalline body represented by a compositional formula RM(QO<SUB>4</SUB>)<SUB>3</SUB>, wherein R represents at least one selected from Zr and Hf, M represents at least one selected from Mg, Ca, Sr, Ba and Ra, and Q represents at least one selected from W and Mo.
申请公布号 US7049257(B2) 申请公布日期 2006.05.23
申请号 US20040885950 申请日期 2004.07.08
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 OMOTE ATSUSHI;SUZUKI TOMOKO;SUZUKI MASA-AKI
分类号 C04B35/03;C01G39/00;C01G41/00;C04B35/486;C04B35/495 主分类号 C04B35/03
代理机构 代理人
主权项
地址
您可能感兴趣的专利