发明名称 Integrated power supply and air inlet unit
摘要 An integrated power supply air inlet unit ( 124 ) coupled to slidably insert into a first interspace region ( 120 ) of an embedded computer chassis ( 100 ), where the first interspace region is defined by a module portion ( 102 ), a rear surface ( 110 ) and a first side surface ( 112 ), includes a power supply ( 128 ) coupled to supply power to the embedded computer chassis, and a front surface ( 130 ) that is substantially perpendicular to the first side surface. A cooling air mass ( 140 ) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular ( 150 ) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.
申请公布号 US7050301(B2) 申请公布日期 2006.05.23
申请号 US20040927881 申请日期 2004.08.26
申请人 MOTOROLA, INC. 发明人 WONG HENRY;BLANKENSHIP DALE C.;KELLY JOHN H.;LILES DENNIS E.;NAUFEL NAUFEL C.;HILL CHARLES C.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利