摘要 |
An integrated power supply air inlet unit ( 124 ) coupled to slidably insert into a first interspace region ( 120 ) of an embedded computer chassis ( 100 ), where the first interspace region is defined by a module portion ( 102 ), a rear surface ( 110 ) and a first side surface ( 112 ), includes a power supply ( 128 ) coupled to supply power to the embedded computer chassis, and a front surface ( 130 ) that is substantially perpendicular to the first side surface. A cooling air mass ( 140 ) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular ( 150 ) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.
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