| 摘要 |
A number of processes and the cost for mounting the semiconductor device are reduced by reducing the number of kinds of adhesives necessary for mounting the semiconductor device having a plurality of stud bumps to a mounting substrate. An electrically non-conductive adhesive is applied to a planer surface of a hard material member. The semiconductor device is attached to a bonding head. The stud bumps of the semiconductor device are leveled by being pressed against the planer surface of the hard material member by the bonding head. A predetermined amount of the electrically non-conductive adhesive can be applied to a mounting area of the semiconductor device by separating the semiconductor device from the planer surface of the hard material member. The semiconductor device is fixed to the mounting substrate by placing the semiconductor device on the mounting substrate and curing the electrically non-conductive adhesive on the mounting surface of the semiconductor device. |
