发明名称 |
FILM ADHESIVE AND SEMICONDUCTOR PACKAGE USING THE SAME |
摘要 |
A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape. |
申请公布号 |
KR20060052636(A) |
申请公布日期 |
2006.05.19 |
申请号 |
KR20050108088 |
申请日期 |
2005.11.11 |
申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
KODAMA YOUICHI;ITAMI SEIJI;SATO KUNIAKI;TAHARA SHUJI |
分类号 |
C09J7/02;C09J179/08;H01L21/52 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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