| 摘要 |
The capacitor element includes a chip body 2 prepared by compacting valve metal powder into a porous body and sintering the body, and an anode bar 3 fixed to the chip body so as to project from an end surface 2 a of the chip body. A solid electrolyte layer 5 of conductive polymer is formed on the chip body via a dielectric film 4 . A cathode film 6 is formed on the solid electrolyte layer. The solid electrolyte layer 5 formed at the end surface 2 a of the chip body 2 includes carbide 5 a formed by pyrolysis of the solid electrolyte layer to surround the entire circumference of the anode bar 3 , so that damage is prevented from occurring at the root portion of the anode bar. |
