| 摘要 |
A method of manufacturing a semiconductor device, including the following steps,
forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness,
exposing an upper surface of the bump by removing a part of the resin layer right above the bump by exposing and then developing the resin layer, and
bonding the semiconductor chip provided with a resin film formed of the resin layer face-down to a substrate, the bump of the semiconductor chip and a conductive section of the substrate being electrically connected by the resin film functioning as an adhesive. |
