REFLOW SOLDERING METHOD USING PB-FREE SOLDER ALLOY AND HYBRID PACKAGING METHOD AND STRUCTURE

摘要

A hybrid packaging method employing a Pb- free solder alloy characterized by comprising a step for performing reflow soldering of a surface mounting component (2) onto at least the upper surface of a circuit board (1) using Pb-free solder paste of Sn-(1- 4)Ag-(0-1)Cu-(7-10)In (unit: mass%) based alloy, a step for inserting the lead or terminal of an insertion mounting component (5) into a through hole made through the circuit board (1) from the upper surface side, a step for applying flux, a step for preheating, and a step for flow- soldering the lead or terminal of an insertion mounting component to the circuit board by spraying a jet flow (3) of Pb-free solder to the lower surface of the circuit board (1) which is preheated in the preheating step.