| 摘要 |
A result of formation of an opening in a semiconductor substrate (1) can be judged without cutting a semiconductor wafer and observing a cross-section of the cut wafer. A semiconductor device of this invention includes a semiconductor substrate (1), a pad electrode formed on the semiconductor substrate (1), an opening formed in the semiconductor substrate (1) to expose the pad electrode, a wiring layer connected with the pad electrode through the opening and a monitoring opening (6b) formed in a scribe line to monitor a result of the formation of the opening. |
