发明名称 |
PROTECTING RESIN-ENCAPSULATED COMPONENTS. |
摘要 |
<p>A method of protecting surface mount capacitors (40) from moisture and oxygen corrosion by applying a thermally curable pre-coat resin (48) to a portion of the terminals (41, 43) of a capacitor (40) and encapsulating the capacitor element(s) (42) with a protective resin (46). The pre-coat resin (48) is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin (48) may be applied to a solder coating-free portion (50) of the terminals (41, 43) by brush or wiper prior to encapsulating the capacitor element(s) (42) with the protective resin (46).</p> |
申请公布号 |
MXPA05008544(A) |
申请公布日期 |
2006.05.19 |
申请号 |
MX2005PA08544 |
申请日期 |
2004.02.10 |
申请人 |
KEMET ELECTRONICS CORPORATION. |
发明人 |
DAVID ALEXANDER WHEELER |
分类号 |
H01G;H01G9/00;H01G9/012;H01L23/495;(IPC1-7):H01G00/00 |
主分类号 |
H01G |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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