发明名称 PROTECTING RESIN-ENCAPSULATED COMPONENTS.
摘要 <p>A method of protecting surface mount capacitors (40) from moisture and oxygen corrosion by applying a thermally curable pre-coat resin (48) to a portion of the terminals (41, 43) of a capacitor (40) and encapsulating the capacitor element(s) (42) with a protective resin (46). The pre-coat resin (48) is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin (48) may be applied to a solder coating-free portion (50) of the terminals (41, 43) by brush or wiper prior to encapsulating the capacitor element(s) (42) with the protective resin (46).</p>
申请公布号 MXPA05008544(A) 申请公布日期 2006.05.19
申请号 MX2005PA08544 申请日期 2004.02.10
申请人 KEMET ELECTRONICS CORPORATION. 发明人 DAVID ALEXANDER WHEELER
分类号 H01G;H01G9/00;H01G9/012;H01L23/495;(IPC1-7):H01G00/00 主分类号 H01G
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