| 摘要 |
<p>The manufacture of electronic chips from a semiconductor wafer, incorporating a thin active layer (12) of semiconductor material on its leading surface, includes the production of engraved layers on the active layer, the transfer of the wafer by its leading surface on to a transfer substrate (40), the thinning of the semiconductor wafer by its rear surface and the deposition and engraving of layers of material on the thinned rear surface. Some vertical narrow trenches are hollowed out in the wafer by the leading surface, prior to the transfer. - The trenches extend into the wafer to a depth almost equal to the residual thickness of the semiconductor wafer that will subsist after the thinning operation. The trenches are filled with conducting material insulated from the active layer and constituting conducting tracks (20', 22', 24', 26') between the leading surface and the rear surface of the thinned layer. - An INDEPENDENT CLAIM is also included for a colour image sensor.</p> |
