| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding apparatus for detecting non-deposition even to the device having lower electrostatic capacitance. <P>SOLUTION: In the wire bonding apparatus for connecting with wire an electrode of a semiconductor chip 43 and a lead of lead frame and the wire bonding apparatus for bonding bump to pad of semiconductor chip, this wire bonding apparatus comprises an applying means for applying the DC pulse to wire or bump, a detecting means for detecting response waveform from the wire or bump by applying the DC pulse thereto, and a determining means for determining whether the wire or bump is connected normally with bonding or not by comparing the response waveform with non-bonding response waveform from the wire or bump obtained by applying the DC pulse to the wire or bump where the bonding is completed erroneously. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
