摘要 |
PROBLEM TO BE SOLVED: To provide a small sensor chip excellent in durability, and to provide a method for manufacturing such a sensor chip conveniently. SOLUTION: The sensor chip comprises a sensor body having an active surface and a plurality of terminals in the outside region thereof, and a protective material having a corridor-like protrusion integrally on one side thereof. The protrusion of the protective material is bonded to the sensor body in the outside region of the active surface of the sensor body such that the protective material opposes the active surface through a desired gap. The area of the protective material opposing the sensor body is not larger than the area of the sensor body. COPYRIGHT: (C)2006,JPO&NCIPI
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