METHOD FOR ARRANGING A FLIP CHIP ON A SUBSTRATE

摘要

The invention relates to a method for arranging a flip chip (3) on a substrate (2), whereby a mechanical fixing (6) of the flip chip (3) on the substrate (2) in a centered manner relative to the flip chip (3) is brought about while simultaneously producing a gap (7) between the flip chip (3)and the substrate (2) which gap surrounds the mechanical fixing (6). The invention also relates to a corresponding arrangement, a computer program and a computer program product.