摘要 |
<p>This invention provides a liquid curable resin composition and a cured film comprising the same. The liquid curable resin composition comprises (A) a fluoropolymer, (B) a heat curable compound, (C) a curing catalyst, (D) metal oxide particles having a number average particle diameter of not more than 100 nm, (E-1) one or at least two solvents having a high capability of dissolving the fluoropolymer (A) (hereinafter referred to as "highly volatile solvent (E-1)", (E-2) one or at least two solvents capable of highly stably dispersing the metal oxide particles (D) and compatible with the highly voltage solvent (E-1) (hereinafter referred to as "slowly volatile solvent (E-2)"), and (F) an actinic radiation curable compound, and the relative evaporation speed of the highly volatile solvent (E-1) is larger than the relative evaporation speed of the slowly volatile solvent (E-2).</p> |
申请人 |
JSR CORPORATION;SHIMOMURA, HIROOMI;DOIMOTO, MITSUNOBU;SUZUKI, YASUNOBU;YAMAMURA, TETSUYA;TANABE, TAKAYOSHI;TAKASE, HIDEAKI |
发明人 |
SHIMOMURA, HIROOMI;DOIMOTO, MITSUNOBU;SUZUKI, YASUNOBU;YAMAMURA, TETSUYA;TANABE, TAKAYOSHI;TAKASE, HIDEAKI |