发明名称 HEAT-ACTIVABLE ADHESIVE TAPE FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS
摘要 <p>Heat-activable adhesive tape comprises adhesive containing acid modified or acid-anhydride-modified vinyl aromatic block copolymer, and epoxide compound. Independent claims are included for: (1) bonding plastic parts comprising adhering heat activable adhesive tape to the plastic parts; (2) bonding polyimide comprising adhering a heat activable adhesive tape to the polyimide;and (3) a device comprising plastic parts, electronic components, flexible printed circuits, and/or polyimide adhered to the heat activable adhesive tape.</p>
申请公布号 KR20060048623(A) 申请公布日期 2006.05.18
申请号 KR20050056309 申请日期 2005.06.28
申请人 TESA AG 发明人 KRAWINKEL THORSTEN;RING CHRISTIAN
分类号 C09J7/02;B32B7/12;B32B15/04;C08F8/00;C08L83/00;C09J7/00;C09J135/06;C09J153/02;C09J163/00;H05K3/32 主分类号 C09J7/02
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