| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem wherein the process of mounting a support substrate on an LED wafer involves high cost, thereby lowering the productivity. <P>SOLUTION: LED epitaxial layer (n-type, p-type, and activation layer) grows on a substrate. In each die, n-layer and p-layer are electrically connected to a package substrate extending across a boundary of LED, so that the LED layer is sandwiched in between a package substrate and a growth substrate. The package substrate comprises a conductor that conducts a package connection capable of performing electrical contact and soldering. The growth substrate is removed. Since a fine and thin LED layer is mounted on the growth substrate and connected to the package substrate, an intermediate support substrate for LED layer is not required. Next, a comparatively thick LED epitaxial layer closely to the removed growth substrate is made thin, its uppermost surface is processed, and a light pick-up structure part is incorporated. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
