发明名称 METAL-CLAD SUBSTRATE AND ITS MANUFACTURING PROCESS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a metal substrate in which the adhesion strength between the metal film and the plastic film and its stability are high and the thickness of the metal film can be made thin. <P>SOLUTION: A plastic film which is the material for the substrate is placed in a vessel for silane coupling agent coating. The plastic film is dried at 300°C. While temperature is maintained at 300°C, the vaporized silane coupling agent is sprayed onto the plastic film to coat the surface of the plastic film with the silane coupling agent. A copper film is formed on the silane coupling agent-coated surface of the plastic film by sputtering. A glossy copper film with a desired thickness is plated on the plastic film having the sputtered copper film. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006123425(A) 申请公布日期 2006.05.18
申请号 JP20040316702 申请日期 2004.10.29
申请人 DOWA MINING CO LTD 发明人 KOHAYASHI SHUICHI;SAWABE AKIO;KITAMURA MASAHIRO
分类号 B32B15/08;H05K1/09 主分类号 B32B15/08
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