| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small sensor chip excellent in durability, and to provide a method for manufacturing such a sensor chip conveniently. <P>SOLUTION: The sensor chip is provided with a protective material bonded through a corridor-like sealing frame arranged in the outside region of the active surface of a sensor body such that the protective material opposes the active surface through a gap. The sensor body has a plurality of terminals outside the region arranged with the sealing frame which is an insulating resin member containing beads, and the area of the protective material opposing the sensor body is not larger than the area of the sensor body. The method for manufacturing the sensor chip comprises a step for manufacturing a sensor body having a plurality of terminals on the active surface and in the outside region thereof, a step for forming a corridor-like sealing frame composed of an insulating resin member containing beads between the active surface of the sensor body and a terminal forming region, and a step for bonding the protective material through the sealing frame such that the protective material opposes the active surface through a gap. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
