| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor wafer by which scratches on a chamfering section caused in a double-face polishing step can be removed and excessive polishing around the outer periphery of main surface of a wafer be also prevented during polishing of the chamfering section when the semiconductor wafer is manufactured, and to provide a semiconductor wafer whose flatness is high even around the chamfering section, as a result. SOLUTION: The method for manufacturing a semiconductor wafer includes at least a double-face polishing step and a chamfering section polishing step. In a first chamfering section polishing step, the respective main-surface side chamfering surface in the chamfering section of the wafer is brought into contact with at least a polishing cloth, so that the chamfering section is polished, and then both surfaces are polished. In a second chamfering section polishing step, the end face of the chamfering section of the wafer is brought into contact with at least the polishing cloth, and while both main surfaces of the wafer are not kept in contact with the polishing cloth, the chamfering section is polished. COPYRIGHT: (C)2006,JPO&NCIPI
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