| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing not containing a halogen-based flame retardant and an antimony compound and excellent in flame retardance, high-temperature storage characteristics and moisture proof reliability. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) aluminum hydroxide and (E) an inorganic filler excluding the aluminum hydroxide as essential components, and the aluminum hydroxide is aluminum hydroxide produced by an underwater discharge method. COPYRIGHT: (C)2006,JPO&NCIPI
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