发明名称 |
THERMOSETTING RESIN COMPOSITION, THERMOSETTING FILM, CURED PRODUCT OF THOSE, AND ELECTRONIC COMPONENT |
摘要 |
Disclosed is a thermosetting resin composition containing an epoxy resin (A), a diene-based crosslinked rubber (B) wherein the amount of bonded acrylonitrile is less than 10% by weight, a curing agent (D) and/or a curing catalyst (E). A cured product obtained by curing such a thermosetting resin composition is excellent in electrical insulation, electrical characteristics and the like. |
申请公布号 |
WO2006051820(A1) |
申请公布日期 |
2006.05.18 |
申请号 |
WO2005JP20547 |
申请日期 |
2005.11.09 |
申请人 |
JSR CORPORATION;NISHIOKA, TAKASHI;GOTOU, HIROFUMI;MIYATA, TSUNEMITSU;IWANAGA, SHIN-ICHIRO |
发明人 |
NISHIOKA, TAKASHI;GOTOU, HIROFUMI;MIYATA, TSUNEMITSU;IWANAGA, SHIN-ICHIRO |
分类号 |
C08G59/40;C08L9/06;C08L63/00 |
主分类号 |
C08G59/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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