发明名称 |
Current collimation for thin seed and direct plating |
摘要 |
A method and apparatus for plating a conductive material onto a substrate is provided. The apparatus includes a fluid processing cell having a fluid basin configured to contain an electrolyte solution and having an opening configured to receive a substrate for processing, an anode assembly positioned in the fluid basin, and a collimator positioned in the fluid basin between the anode assembly and the opening. |
申请公布号 |
US2006102467(A1) |
申请公布日期 |
2006.05.18 |
申请号 |
US20040988646 |
申请日期 |
2004.11.15 |
申请人 |
|
发明人 |
HERCHEN HARALD;DUKOVIC JOHN O.;PANG LILY |
分类号 |
C25C3/16;C25B9/00;C25D17/00 |
主分类号 |
C25C3/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|