| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized crystal oscillator structure in which problems can be solved which are caused by minimizing the outer shape of a crystal vibrator and consequent reduction in the inner volume thereof. SOLUTION: A crystal oscillator 24 is configured by mounting a semiconductor component on a crystal vibrator 25 in which a vibrating portion 1 of a thin crystal blank and a reinforced portion of a thick crystal blank surrounding the vibrating portion are integrated and which performs thickness-shear vibration of AT cut, wherein in the crystal vibrator 25 where main electrodes are formed on both principal surfaces of the vibrating portion 1 and connecting electrodes extending from the main electrodes are formed, a surface 8, at the side of the crystal vibrator, of at least one plate-like container 7 facing the vibrating portion 1 is worked to be recessed, at the same time, between the container 7 and a crystal blank 3, a surface of a semiconductor component 27 packaged in the crystal vibrator 25 air-tightly sealed by filling the connecting electrodes with low fusing point metals 10 is covered with an insulated resin coating 26. Furthermore, the crystal blank 3 held between plate-like containers 7 of the crystal vibrator 25 comprising the crystal oscillator 24 is overcoated with insulating materials on the lateral side of the crystal vibrator 25. COPYRIGHT: (C)2006,JPO&NCIPI
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