| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of acquiring an excellent product with certainty by suppressing the rate of occurrence of defective products in the manufacturing process for forming a semiconductor package wherein ceramic terminals are soldered to the package body. SOLUTION: In the manufacturing method of the semiconductor package which joins a lead 42 to a package body 20 made of metal through a ceramic terminal 30, alignment is performed to a fixture 60 mutually between a package body 20 and a lead joining body 50 consisting of a lead frame 40 which carries out alignment of the lead 42 to the electrode formed in the ceramic terminal 30 and the ceramic terminal, so that the semiconductor package may be set and assembled in the inside of a heating furnace by soldering the package body 20 and the ceramic terminal 30 of the lead joining 50. COPYRIGHT: (C)2006,JPO&NCIPI
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