发明名称 ADHESIVE RESIN FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive resin film capable of preventing cell crack generated in a laminate process that is one among manufacturing processes of a solar cell module using a thinned cell, and of reducing false mounting between the solar battery cell and a light emitting element, and between the cell and an adhesive resin, and to provide a manufacturing method of a semiconductor module. <P>SOLUTION: The adhesive resin film seals a semiconductor element group between a first transparent insulating substrate and a second insulating substrate, wherein it includes a shape corresponding to the surface shape of the semiconductor element group. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006128289(A) 申请公布日期 2006.05.18
申请号 JP20040312517 申请日期 2004.10.27
申请人 SHARP CORP 发明人 YAMASHITA KATSUYA
分类号 H01L31/04;H01L33/56 主分类号 H01L31/04
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