| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance intra-plane uniformity in laser processing, in an apparatus in which a cup with a chuck arranged is horizontally moved and in which for example dicing is performed by a laser beam with a liquid interposed on the surface of a wafer. <P>SOLUTION: Prescribed processing is performed by irradiating a wafer surface with a laser beam, with a liquid supplied to the wafer surface, from a light irradiation part 4 which includes a light oscillating part 41 for emitting a laser beam and an optical system unit 45 for forming an image on the wafer surface with the laser beam emitted from the light oscillating part 41, wherein a distance M1 between the wafer W surface and the optical system unit 45 is measured by a displacement gauge 5 and, on the basis of this measurement, the height position of the optical system unit 45 from the wafer surface is corrected to perform the prescribed laser processing. Even with the presence of ruggedness on the wafer surface, the distance between the wafer surface and the optical system unit 45 is made uniform; therefore, the laser beam is evenly emitted to the wafer, to perform the processing with high intra-plane uniformity. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
