CIRCUIT CONNECTION MATERIAL, CONNECTION STRUCTURE OF CIRCUIT TERMINAL AND CONNECTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a circuit connection material hardly causing warpage as compared with a conventional cation/epoxy-cured system, in low-temperature connection, for instance, at 160°C for 10 sec. SOLUTION: This circuit connection material 4 is interlaid between circuit electrodes 1a and 2a facing each other for electrically connecting the electrodes 1a and 2a by heating and pressing the circuit electrodes 1a and 2a facing each other only in the pressurized direction. The circuit connection material contains the following constituents (1)-(4): (1) a radical polymerizing substance; (2) a polymerization initiator generating an uncombined radical by heating; (3) an epoxy resin; and (4) a cation polymerizing initiator. COPYRIGHT: (C)2006,JPO&NCIPI