发明名称 FILM MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a film material having the heat conductivity smaller than that of zirconia without any problem of the phase transition. SOLUTION: A film having low heat conductivity and peeling resistance is realized by using a compound of high dielectric constant for a film material. More specifically, a thermal barrier coating material mainly contains a dielectric having the refractive index of≥2.2 at the temperature of 25°C and the wavelength of 600 nm. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006124734(A) 申请公布日期 2006.05.18
申请号 JP20040311605 申请日期 2004.10.26
申请人 MITSUBISHI HEAVY IND LTD 发明人 NAGANO ICHIRO;AKIYAMA KATSUNORI;SHIDA MASAHITO;MORITA SHOJI;MURAKAMI YUICHIRO
分类号 C23C4/04 主分类号 C23C4/04
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