| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good curability, flowability and storage properties and a semiconductor device excellent in soldering crack resistance and resistance to moisture reliability. SOLUTION: The epoxy resin composition comprises a compound (A) having two or more epoxy groups in the molecule, a compound (B) having two or more phenolic hydroxy groups in the molecule, a latent catalyst (C) having a cationic moiety capable of accelerating the curing reaction of an epoxy resin and a silicate anionic moiety to inhibit the activity to accelerate the above curing reaction, and a compound (D) in which hydroxy groups are bonded to two or more adjacent carbon atoms constituting an alicyclic, aromatic ring or heterocyclic structure, respectively. The semiconductor device has electronic parts sealed with a cured product of the epoxy resin composition containing an inorganic filler. COPYRIGHT: (C)2006,JPO&NCIPI
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