Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck

摘要

An apparatus including a support table for supporting a substrate is disclosed. The support table includes a plurality of support protrusions that contact the substrate during use for supporting the substrate. The support table includes a plurality of heat transfer protrusions that extend towards the substrate during use without contacting the substrate when the substrate is supported by the support protrusions. Gas-containing heat exchanging gaps for exchanging heat with the substrate extend between the heat transfer protrusions and the substrate.