发明名称 POLISHING PAD HAVING A PRESSURE RELIEF CHANNEL
摘要 The present invention provides a chemical mechanical polishing pad comprising a window formed in the polishing pad, the window having a void provided on a side thereof. The polishing pad further comprises a void-pressure relief channel provided in the polishing pad from the void to a periphery of the polishing pad.
申请公布号 KR20060048382(A) 申请公布日期 2006.05.18
申请号 KR20050051542 申请日期 2005.06.15
申请人 ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 发明人 CRKVENAC T.T.;GAMBLE ROBERT T.;LAWHORN JASON M.
分类号 B24B37/04;B24D7/12;B32B3/10;H01L21/304 主分类号 B24B37/04
代理机构 代理人
主权项
地址