A land grid array (LGA) socket for delivering power from a printed wiring board to a microprocessor chip, and power terminals for use in the LGA socket. The power terminals are such that they can interface with the standard array of contact pads on both the printed wiring board and the microprocessor chip, by using multiple contact pads per power terminal as compared to signal terminals that only use a single contact pad per signal terminal.
申请公布号
WO2006053030(A2)
申请公布日期
2006.05.18
申请号
WO2005US40570
申请日期
2005.11.10
申请人
MOLEX INCORPORATED;REGNIER, KENT, E.;RAMEY, SAMUEL, C.