PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To thin a printed wiring board much more by not only thinning a structure material of the board but also reviewing a construction. SOLUTION: Insulating films 31 and 41 of a laminated plate for making multiple layers are extended to a cable B of a base substrate. The insulating films 31 and 41 protect and cover conductive layers 12 and 13 of the cable B, and a cover lay is omitted. COPYRIGHT: (C)2006,JPO&NCIPI