| 摘要 |
A heat-dissipating device has multiple conduction paths, and is especially adapted to a package with MPMs (Multiple Packaging Modules). The package is mounted on one side of a PCB. The heat-dissipating device has a first heat-dissipating unit, a second heat-dissipating unit, and a thermal bridge unit. The first heat-dissipating unit is contacted with a first heat source of the package element. The second heat-dissipating unit penetrates through the PCB and contacts with a second heat source of the package element. The thermal bridge unit penetrates through the PCB and connects the first heat-dissipating unit and the second heat-dissipating unit.
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