| 发明名称 |
SURFACE PROTECTING FILM FOR SEMICONDUCTOR WAFER AND METHOD OF PROTECTING SEMICONDUCTOR WAFER USING THE SAME |
| 摘要 |
The present invention is to provide a surface protecting film for a semiconductor wafer which can prevent breakage of the semiconductor wafer even when the semiconductor wafer is thinned to not more than 200 mum, and a method of protecting the semiconductor wafer using the protecting film. The present invention relates to a surface protecting adhesive film for a semiconductor wafer comprising a base film having an adhesive layer formed on one surface thereof, wherein the base film comprises a layer (A) having a storage elastic modulus of from 1x10<SUP>7 </SUP>Pa to 1x10<SUP>9 </SUP>Pa at a temperature range of from 20° C. to 180° C. |
| 申请公布号 |
KR20060047526(A) |
申请公布日期 |
2006.05.18 |
| 申请号 |
KR20050035027 |
申请日期 |
2005.04.27 |
| 申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
SUGIMOTO KOSUKE;SAIMOTO YOSHIHISA;KATAOKA MAKOTO;MIYAKAWA MASAFUMI;HAYAKAWA SHINICHI |
| 分类号 |
H01L21/02;H01L21/683;B32B7/12;H01L21/00;H01L21/301;H01L21/304;H01L21/68 |
主分类号 |
H01L21/02 |
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