| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method that prevents semiconductor chip misalignment for precise chip mounting on a circuit board when the semiconductor chip is mounted on the circuit board through flip chip connection using ultrasonic vibration. <P>SOLUTION: In this electronic device mount structure, a semiconductor chip is mounted on a circuit board 20 with an electrode terminal 22 through flip chip connection made by applying ultrasonic vibration to a semiconductor chip 10. The relatively deviated semiconductor 10 and circuit board 20 are mounted through mutual connection of a bump 12 and electrode terminals 20c to 20f in a way that the center of the bump 12 in the semiconductor chip 10, and the lateral center of electrode terminals 22c to 22f in the circuited board 20 can be positioned parallel to a vibration direction of the above ultrasonic vibration. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
