| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which connection reliability is enhanced by enhancing connection strength of a semiconductor chip and wiring while lowering the resistance, and to provide its manufacturing method. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 2 and wiring 6 for connection with the terminal 4 of the semiconductor chip 2. In the semiconductor chip 2, uppermost layer 4c of the terminal 4 is composed of any one kind of gold, silver, copper, tin or indium, the wiring 6 is formed of sintered body of fine metal particles composed of any one kind of gold, silver or copper, and at least a part of joint between the wiring 6 and the terminal 4 is grown epitaxially. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
