| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting electronic component element by which the occurrence of defective mounting of an electronic component element can be reduced effectively and, in addition, the mounting work of the electronic component element can be performed efficiently, and to provide a method of manufacturing electronic device. <P>SOLUTION: By using a master substrate 10 on which substrate regions 14 and extra margin regions 11 integrally formed with the substrate regions 14 are arranged in a matrix-like state in the X and Y directions, and two recognition patterns 12a and 12b are formed by arranging electronic component element mounting electrode pads 3 in the substrate regions 14 in a state where the pads 3 are shifted in the X and Y directions in the extra margin regions 11, the deviated amounts are measured between the reference positions of the recognition patterns 12a and 12b and solder paste applied to the surfaces of the patterns 12a and 12b. Then an electronic component element is mounted on each substrate region 14 based on the correction value obtained from two measured results. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
