| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor chip is mounted on a circuit board containing a conductive core board capable of easily processing with the core board for improved deflection of the core board and adhesion to a resin layer. SOLUTION: The semiconductor device comprises a porous metal layer 10 in which a plurality of air holes 10x are provided from the interior to the outer surface with an embedded resin layer 12c formed in the air hole 10x, a core board 5 consisting of resin layers 15a and 15b formed on both surfaces of the porous metal layer 10, wiring layers 24a and 24b formed on the resin layers 15a and 15b, and a semiconductor chip 30 which is electrically connected to the wiring layers 24a and 24b and mounted on the core board 5. The core board 5 is provided with a cavity 26, and the back surface side of the semiconductor chip 30 is electrically connected to the porous metal layer 10 at the bottom part of the cavity 26. COPYRIGHT: (C)2006,JPO&NCIPI
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