发明名称 SUBSTRATE JOINING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate joining device which is equipped with a shutter assembling system for forming a vacuum space for joining substrates. SOLUTION: The substrate joining device for joining a pair of substrates is characterized by including: a first pressurizing plate and a second pressurizing plate to support the respective substrates; a transfer portion arranged so as to transfer at least one out of the first and second pressurizing plates; the shutter assembling system having a plurality of shutters arranged so as to be in close contact with the first and second pressurizing plates in order to form a closed space together with the first and second pressurizing plates, and a shutter driving portion to drive the shutters so as to bring them into close contact with the first and second pressurizing plates; and an evacuating portion to evacuate a gas from the closed space formed with the first and second pressurizing plates and the shutter assembling system. Thereby the distance of separation between the substrates is suitably adjusted and vacuum evacuation efficiency in the vacuum operation is improved. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006126789(A) 申请公布日期 2006.05.18
申请号 JP20050214779 申请日期 2005.07.25
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE SUNG-JIN;RYO URETSU;RI SHUNKO
分类号 G02F1/1333 主分类号 G02F1/1333
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