| 摘要 |
A surface mount device (SMD) light emitting diode (LED) package structure is disclosed. The structure includes a cup-structure substrate, a lead frame, an LED chip, a set of conducting wires, and a transparent or semi-transparent seal. The inner or outer surface of the cup-structure substrate includes a plurality of indentations that may be different in number, size, depth, and shape. The indentations are formed by injection molding techniques or pressure stamping. By filling the indentations with the transparent or semi-transparent seal, the SMD LED package structure is able to enhance the attachment between the cup-structure substrate and the seal and thereby effectively prevent any separation from the two bodies as a result of an external force.
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