Substrate processing apparatus, substrate processing method, substrate position correcting apparatus, and substrate position correcting method

摘要

A substrate W rotates about the center of rotations A 0 of a spin base 3 , while supported by plural support pins 5 in such a manner that the substrate W can freely slide and while held owing to the force of friction which develops between the bottom surface of the substrate W and the support pins 5 . After a detection sensor 74 detects, while the substrate W rotates, an edge surface position (eccentric position) of the edge surface of the substrate which is the farthest from the center of rotations A 0 , a press block 71 pushes this edge surface position to a preset position P 1 which is away along the horizontal direction from the center of rotations A 0 by a distance which is determined in accordance with the radius of the substrate W. This aligns the eccentric position to the preset position P 1 and positions the center W 0 of the substrate within a predetermined range from the center of rotations A 0.