An illumination assembly includes a heat dissipating member having a plurality of circuitized strips disposed thereon a spaced relationship. Each circuitized strip includes an electrically insulative substrate having at least one circuit trace on a first side of the substrate and an electrically and thermally conductive layer on a second side of the substrate, such that the at least one circuit trace is electrically insulated from the second side of the substrate. The circuitized strips have a plurality of vias extending from the first side to the second side of the substrate. A plurality of LEDs are disposed in the plurality of vias, such that each LEDs is disposed on the electrically and thermally conductive layer on the second side of the substrate and electrically connected to the at least one circuit trace on the first side of the substrate.
