| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent such problems wherein a photosensitive layer can not be removed or a photoresist layer easily peels, while keeping the adhesiveness of a photosensitive layer when a recording medium, such as a printed wiring board having a photosensitive layer with sensitivity with respect to light, such as a resist layer deposited thereon is exposed to light for transferring a pattern. <P>SOLUTION: When a resist layer formed on a substrate is exposed to transfer a wiring pattern by an exposure apparatus 3, the irradiation energy of light irradiating an edge area of the wiring pattern is controlled to be higher than the irradiation energy of light irradiating other regions, other than the edge region. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
